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November 2006 rev 2.2 Notebook LCD Panel EMI Reduction IC
Features
* * * * *
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ASM3P18S19B
allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding, and other passive components that are traditionally required to pass EMI regulations. The ASM3P18S19B modulates the output of a single PLL in order to "spread" the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal's bandwidth is called `Spread Spectrum Clock Generation'. The ASM3P18S19B uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method.
FCC approved method of EMI attenuation. Provides up to 15dB EMI reduction. Generates a low EMI Spread Spectrum clock and a non-spread reference clock of the input frequency. Optimized for Frequency range from 20 to 40MHz. Internal loop filter minimizes external components and board space. Low Inherent Cycle-to-Cycle jitter. Two spread % selections: -1.25% to -1.75%. 3.3V Operating Voltage. Low power CMOS design.
Supports notebook VGA and other LCD timing controller applications. Power Down function for mobile application. Available in Commercial temperature range.
Available in 8-pin SOIC and TSSOP Packages. RoHS Compliant
Applications
The ASM3P18S19B is targeted towards EMI management for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC peripheral devices, consumer electronics, and embedded controller systems.
Product Description
The ASM3P18S19B is a Versatile Spread Spectrum Frequency Modulator designed specifically for input clock frequencies from 20 to 40MHz. (Refer Input Frequency and Modulation Rate Table). The ASM3P18S19B reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data dependent signals. The ASM3P18S19B
Block Diagram
PD#
SRS
VDD
Modulation XIN/CLKIN Crystal Oscillator Frequency Divider Feedback Divider
PLL
XOUT
Phase Detector
Loop Filter
VCO
Output Divider
REF
ModOUT
VSS
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 * Tel: 408-879-9077 * Fax: 408-879-9018 www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
November 2006 rev 2.2
Pin Configuration
XIN/ CLKIN VSS SRS ModOUT 1 2 3 4 8 7 6 5 XOUT VDD PD# REF
ASM3P18S19B
ASM3P18S19B
Pin Description
Pin#
1 2 3 4 5 6 7 8
Pin Name
XIN / CLKIN VSS SRS ModOUT REF PD# VDD XOUT
Type
I P I O O I P O
Description
Crystal Connection or external frequency input.This pin has dual functions. It can be connected to either an external crystal or an external reference clock Ground Connection. Connect to system ground. Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Selection Table). This pin has an internal pull-up resistor. Spread spectrum clock output. (Refer Input Frequency and Modulation Rate Table and Spread Deviation Selection Table) Non-modulated Reference clock output of the input frequency. Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. Power Supply for the entire chip. Crystal Connection. Input connection for an external crystal. If using an external reference, this pin must be left unconnected.
Input Frequency and Modulation Rate Part Number
ASM3P18S19B
Input Frequency Range
20MHz to 40MHz
Output Frequency range
20MHz to 40MHz
Modulation rate
Input Frequency / 512
Spread Deviation Selection Part Number
ASM3P18S19B
SRS
0 1
Spread Deviation
-1.25% (DOWN) -1.75% (DOWN)
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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November 2006 rev 2.2
Absolute Maximum Ratings Symbol
VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B)
ASM3P18S19B
Parameter
Rating
-0.5 to +4.6 -65 to +125 0 to +70 260 150 2
Unit
V C C C C KV
Voltage on any pin with respect to Ground
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25C) unless otherwise stated)
Symbol
VIL VIH IIL IIH IXOL IXOH VOL VOH ICC IDD VDD tON ZOUT Input Low voltage Input High voltage
Parameter
Min
VSS - 0.3 2.0 -60.0 2.5 7.1 fIN - min -
Typ
3 3 4.5 3.3 0.18 50
Max
0.8 VDD + 0.3 -20.0 1.0 0.4 26.9 fIN - max -
Unit
V V A A mA mA V V mA mA V mS
Input Low current (inputs PD#, SRS) Input High current XOUT Output low current @ 0.4V, VDD = 3.3V XOUT Output high current @ 2.5V, VDD = 3.3V Output Low voltage VDD = 3.3V, IOL = 20mA Output High voltage VDD = 3.3V, IOH = 20mA Dynamic supply current normal mode 3.3V and 25pF probe loading Static supply current standby mode Operating Voltage Power up time (first locked clock cycle after power up) Clock Output impedance
AC Electrical Characteristics Symbol Parameter
fIN fOUT tLH* tHL* tJC tD Input Frequency Output Frequency Output Rise time Measured from 0.8V to 2.0V Output Fall time Measured from 0.8V to 2.0V Jitter (Cycle to cycle) Output Duty cycle
Min
20 20 -200 45
Typ
0.66 0.65 50
Max
40 40 200 55
Unit
MHz MHz nS nS pS %
*tLH and tHL are measured into a capacitive load of 15pF
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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November 2006 rev 2.2
Package Information 8-lead (150-mil) SOIC Package
ASM3P18S19B
Dimensions Symbol Min
A1 A A2 B C D E e H L 0.004 0.053 0.049 0.012 0.007
Inches Max
0.010 0.069 0.059 0.020 0.010
Millimeters Min Max
0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0 1.27 8 0.25 1.75 1.50 0.51 0.25
0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0 0.050 8
Package length (Excluding end flash)D - 188 ~ 193 mils. Package length (Including end flash) D1 - 198 ~ 207 mils.
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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November 2006 rev 2.2
8-lead TSSOP (4.40-MM Body)
ASM3P18S19B
H
E D A2 A e B A1 L C
Dimensions Symbol Min
A A1 A2 B C D E e H L 0.020 0 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8 0.50 0
Inches Max
0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30
Millimeters Min Max
1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8
Note: Controlling dimensions are millimeters TSSOP - 0.0325 grams unit weight
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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November 2006 rev 2.2
Ordering Information Part Number
ASM3P18S19BF-08TT ASM3P18S19BF-08TR ASM3P18S19BF-08ST ASM3P18S19BF-08SR ASM3P18S19BG-08TT ASM3P18S19BG-08TR ASM3P18S19BG-08ST ASM3P18S19BG-08SR
ASM3P18S19B
Marking
3P18S19BF 3P18S19BF 3P18S19BF 3P18S19BF 3P18S19BG 3P18S19BG 3P18S19BG 3P18S19BG
Package Type
8-Pin TSSOP, TUBE, Pb Free 8-Pin TSSOP, TAPE & REEL , Pb Free 8-Pin SOIC, TUBE, Pb Free 8-Pin SOIC, TAPE & Pb Free 8-Pin TSSOP, TUBE, Green 8-Pin TSSOP, TAPE & REEL, Green 8-Pin SOIC, TUBE, Green 8-Pin SOIC, TAPE & REEL, Green
Temperature
Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial
Products are available for industrial temperature range operation. Please contact factory for more information.
Device Ordering Information
ASM3P18S19BF-08TR
R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
PulseCore Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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November 2006 rev 2.2
ASM3P18S19B
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com
Copyright (c) PulseCOre Semiconductor All Rights Reserved Part Number: ASM3P18S19B Document Version: 2.2
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003
(c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Power Mobile VGA EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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